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Titre: Leading and bleeding edge technologies towards higher performance and smaller form factor micro-electronic systems
Conférencier: Kevin Kendrick , director of business development, ENGENT Inc.
Lieu: École Polytechnique de Montréal, Pavillon Lassonde, M-1410 ,
Date et heure: mardi le 13 novembre 2012 de 12:00 à 13:00

Résumé: Kevin Kendrick, director of business development at ENGENT Inc. will present leading edge assembly and packaging technologies enabling miniaturization and higher performance for micro-electronic systems. Engent is a provider of next generation electronic assembly manufacturing and technology services. They help their clients realize product designs that require a range from small form factors to high performance packaging for electronics and micro-electronic systems. Their focus is on leading and bleeding edge technologies towards higher performance in a smaller form factor which include flip chip assembly, MEMS packaging, wire bond, 01005 & the new 0.25 x 0.125 mm passives, and 3D die/wafer integration. They also have experience using a variety of substrates including flex, silicon, organic and ceramic. Engent's supporting engineering services allow their customers to incorporate future requirements into their products of tomorrow.

Their capabilities include:
• Production of microelectronic and system-in-package assemblies
• Prototyping and production ramp to volume
• New product development and introduction
• New process development
• Semiconductor packaging qualification
• ISO 9001:2008 certified and ITAR registered

Their services comprise manufacturing, research, and development services for the electronics industry. The Engent approach is to provide a suite of services that compliment advanced manufacturing and allows the customer to ensure quick time to market with the most robust and reliable product.

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