Titre: Multi-Heat Sources Silicon-Die Thermal Monitoring Using Embedded Sensor Cells Unit: Challenges and Methodology for thermal peaks detection
Conférencier: Ahmed Lakhssassi , Université du Québec en Outaouais (UQO), Gatineau, Canada
Lieu: ZOOM (lien fourni à l'inscription / link to be sent upon registration) ,
Date et heure: jeudi le 17 février 2022 de 11:30 à 12:30

Résumé: Nowadays, real-time thermal monitoring is essential in integrated circuit (IC) and VLSI chip which are a multilayer structure and a stack of different materials. The evolution of the integrated circuits industry (IC) during the decade has been so rapid that it is possible to integrate complex systems on a single chip (SOC, system on Chip). This trend towards increasingly high levels of integration is driven by the need for increasingly efficient systems and thus dissipating enormous power densities. Currently researchers have already designed an algorithm for detecting thermal peaks in the case of a single heat source based on the GDS (Gradient Direction Sensors) methodology. However, this does not solve the problem of thermal peaks monitoring in LAIC (Large Area Integrated Circuits) circuits. In this paper we presents an algorithmic and the experimental result of multi-sources silicon-die thermal monitoring method using embedded sensor cells unit. The methodology that has been used is based on the generalized GDS methodology for the case of multiple heat sources. The test results of a configuration of embedded four (4) GDS sensor cells unit has been proposed for the detection of thermal peaks in the case of multiple sources. Our results shows that our algorithmic solution give a satisfactory thermal peak prediction with less than 1.2 % error.

Note biographique: Ahmed Lakhssassi received the B.Eng. and M.Sc. A in electrical engineering from Université du Québec à Trois-Rivières (UQTR), Québec, Canada in 1988 and 1990 respectively. He also received the Ph.D. in Energy and Material sciences in 1995 from INRS-Énergie et Matériaux (Institut National de la Recherche Scientifique), Québec, Canada. At the same year also, he had become a professor of Electro-thermo-mechanical aspects at NSERC -Hydro-Quebec Industrial Research Chair at Electrical Engineering Department of the UQTR, where, for several years, he conducted Electro-thermal research projects. Since 1998, he has been with UQO (Université du Québec en Outaouais), where he is currently titular professor and responsible of the LIMA laboratory (Avanced Microsystem Engineering Laboratory) developing IP core and embedded algorithms for microsystems thermo-mechanical sensors dedicated for thermal peak detection. His research interest is the fields of bio-heat thermal modeling such as: heat diffusion in biological tissues, metabolic heat generation and external interactions, heat transfer mechanism in biological tissues for thermal therapeutic practices including dedicated bio-implantable puce design for cancer thermal dose control. Furthermore, his research interest are in machine learning to recognize the type of pain and to quantify the amount of pain to tracks any potential injury using neural networks and thermal image processing. Also, his research interest is in Design of Fully Automated tool for Porting Analog and Mixed signal circuits within Different Technology nodes. Dr. Lakhssassi is senior member of IEEE, the OIQ (Ordre des Ingénieurs du Québec, Canada), NanoQuébec and has more than twenty-three years' experience with a large expertise with applications in the fields of Electro-Thermo-mechanical analysis for electronic and microelectronics system design. Professor Lakhssassi in a regular member of ReSMiQ (Strategic Alliance in Microsystems of Québec) the largest research center in microelectronics funded by the Government of Québec. He is the author/co-author of more than 240 scientific publications and research report, and thesis advisor of 90 graduate and undergraduate students who completed their studies.

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